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Title:
無線ICデバイス
Document Type and Number:
Japanese Patent JP5510450
Kind Code:
B2
Abstract:
A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.

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Inventors:
Tokiko Kato
Yuya Doumi
Application Number:
JP2011509291A
Publication Date:
June 04, 2014
Filing Date:
April 13, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01Q7/00; G06K19/07; G06K19/077; H01Q1/38; H01Q9/40; H01Q9/42
Domestic Patent References:
JP2008288915A2008-11-27
Foreign References:
WO2009011423A12009-01-22
WO2009011144A12009-01-22
WO2007083575A12007-07-26
Attorney, Agent or Firm:
Patent business corporation Profic patent office
Takeichi Morishita
Tani Kazuhiro



 
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