Title:
無線モジュールおよびその製造方法並びに電子装置
Document Type and Number:
Japanese Patent JP7046723
Kind Code:
B2
Abstract:
A wireless module includes: a substrate having a first surface and a second surface, the second surface being an opposite surface of the substrate from the first surface; an antenna located on the first surface; an electronic circuit that is located on the first surface and/or the second surface, and outputs a high-frequency signal to the antenna and/or receives a high-frequency signal from the antenna; and a foamed resin located on the first surface so as to seal the antenna.
Inventors:
Hitoshi Sangada
Application Number:
JP2018105114A
Publication Date:
April 04, 2022
Filing Date:
May 31, 2018
Export Citation:
Assignee:
Kaga FEI Co., Ltd.
International Classes:
H01Q23/00; H01L23/00; H01L23/28; H01P11/00; H01Q1/38; H01Q1/40; H05K9/00
Domestic Patent References:
| JP2000174532A | ||||
| JP2013179152A | ||||
| JP2017227959A | ||||
| JP63046803A | ||||
| JP2012156657A | ||||
| JP2015156632A |
Foreign References:
| WO2015015863A1 | ||||
| US20140152509 |
Attorney, Agent or Firm:
Shuhei Katayama