To provide a wiring board that can surely remove noise and reduce resistance and inductance of wiring lines connected to a capacitor by incorporating the capacitor, the wiring board incurring a small amount of loss even if trouble occurs to the capacitor and capable of incorporating an inexpensive capacitor with large electrostatic capacitance.

The wiring board 100 has a capacitor 20 incorporated in a through-hole 11 formed in a core substrate body 10, and further has resin insulating layers 41 to 43 and 51 to 53, and wiring layers 45 and 46, and 55 and 56 on upper and lower sides thereof. The capacitor 20 can be connected to the upper and lower sides through pads 21 and 22 formed on its upper surface 20A and lower surface 20B, and is connected to the pad 21 and wiring layer 45, and to the pad 22 and wiring layer 55 to be connected to a flip-chip pad 101 and an LGA pad 103 through many upper capacitor connection wiring lines 60 and lower capacitor connection wiring lines 70.