Title:
WIRING BOARD AND ELECTRONIC COMPONENT USING IT
Document Type and Number:
Japanese Patent JP3951185
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming an insulating body closing one end face of a through hole penetrating outer layer conductors on both sides of a wiring board and durable against high mold resin sealing pressure and high temperature for blocking intrusion of resin enduring against heat and pressure of transfer molding method.
SOLUTION: The wiring board has a non-through conduction hole 7 closed by a two-layer insulating closing body 15 consisting of a filmlike body 11 and an insulating coating 12 covering the upper surface of the filmlike body. The electronic component has an insulating body closing one end face of a through conduction hole penetrating the wiring board and durable against high mold resin sealing pressure and high temperature of transfer molding method.
Inventors:
Satoshi Isoda
Ryoji Sugiura
Hideki Yoshida
Ryoji Sugiura
Hideki Yoshida
Application Number:
JP2003289552A
Publication Date:
August 01, 2007
Filing Date:
August 08, 2003
Export Citation:
Assignee:
Hitachi AIC Co., Ltd.
International Classes:
H05K3/28; H01L23/12; H05K1/02; H05K1/11; (IPC1-7): H05K3/28; H01L23/12; H05K1/02; H05K1/11
Domestic Patent References:
| JP200144316A | ||||
| JP1174410A | ||||
| JP2001196491A | ||||
| JP11251704A | ||||
| JP3145190A |
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