Title:
WIRING BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2023077108
Kind Code:
A
Abstract:
To stabilize a dimension while maintaining flexibility.SOLUTION: A wiring board includes: a plurality of insulation layers made of an insulation resin having flexibility; and a conductive layer that is laminated onto the plurality of insulation layers, and having a conductive pattern. The conductive layer includes a conductive pattern having a formation where a plurality of unit patterns is connected in a flat view. The unit pattern includes: a U-shaped pattern; an inverse U-shaped pattern arranged so as to be separated from an open side of the U-shaped pattern on the open side; and a linear pattern that connects the center portions of the U-shaped pattern and the inverse U-shaped pattern.SELECTED DRAWING: Figure 3
Inventors:
DENDA TATSUAKI
TERASAWA TAKETO
TERASAWA TAKETO
Application Number:
JP2021190262A
Publication Date:
June 05, 2023
Filing Date:
November 24, 2021
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H05K1/02; H01L23/12
Attorney, Agent or Firm:
Sakai International Patent Office