Title:
配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP7007882
Kind Code:
B2
Abstract:
A wiring board includes: a wiring structure including: a first insulating layer; a first wiring layer formed on a bottom surface of the first insulating layer; and a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening; and a support base member bonded to the protective insulating layer with an adhesive layer and has a second opening. A diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.
Inventors:
Kazuhiro Oshima
Atsushi Sato
Kondo Human Resources
Fukase Katsuya
Atsushi Sato
Kondo Human Resources
Fukase Katsuya
Application Number:
JP2017236050A
Publication Date:
January 25, 2022
Filing Date:
December 08, 2017
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2009239224A | ||||
| JP2013058506A | ||||
| JP2014232030A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Keizo Okamoto
Yu Nikaido
Tadahiko Ito
Keizo Okamoto
Yu Nikaido
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