Title:
配線基板およびその製造方法
Document Type and Number:
Japanese Patent JP7122939
Kind Code:
B2
Abstract:
To provide a wiring board in which a bonding material for mounting does not easily flow out from a recess formed by opening on a side surface of a board body, and a manufacturing method thereof.SOLUTION: A wiring board 1a includes a substrate body 2 that is obtained by laminating a plurality of ceramic layers (insulating layers) c1 and c2, and including front and back surfaces 3 and 4 having rectangular outer shapes in a plan view facing each other, and four sides 5 located between the front surface 3 and the back surface 4, an inner wall surface 7a formed to open on the side surface 5 of the substrate body 2 and formed along a direction intersecting the front surface 3 and the back surface 4 of the substrate body 2, a recess 6a having the front surface 3 and the back surface 4 of the substrate body 2 and a parallel bottom surface 8a, a metallization layer 10a including a vertical metallization layer 11a formed on the inner wall surface 7a of the recess 6a, and a lateral metallization layer 12a formed on the bottom surface 8a of the recess 6a, and a ridge 15 made of an insulating material is formed along the outer edge of the bottom surface 8a of the recess 6a on the opening side.SELECTED DRAWING: Figure 1
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Inventors:
Yoshiki Nukaya
Application Number:
JP2018203344A
Publication Date:
August 22, 2022
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K1/11; H01L23/12; H01L23/13; H05K3/40; H05K3/46
Domestic Patent References:
| JP2016201434A | ||||
| JP2012243942A | ||||
| JP2004140111A | ||||
| JP2018006774A | ||||
| JP6140738A | ||||
| JP2005129661A | ||||
| JP2013179157A |
Attorney, Agent or Firm:
Suzuki Manabu
Sakakibara Yasushi
Sakakibara Yasushi
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