PURPOSE: To manufacture simply and conveniently a wiring board being excellent in migration resistance by a method wherein a base is constructed of a layer formed by impregnating glass cloth with thermosetting resin and by setting it and of a layer of high-molecular-weight epoxy resin and an insulating material coming into contact with a wiring is constituted of the high-molecular-weight epoxy resin.
CONSTITUTION: This wiring board is composed of a base and a wiring 4 and the base is constructed of a layer 1 formed by impregnating glass cloth with thermosetting resin and by setting it and of a high-molecular-weight epoxy resin layer 2, while an insulating material coming into contact with the wiring 4 is constituted of high- molecular-weight epoxy resin. In this wiring board, the wiring 4 may be provided on either one or both surfaces of the base and also it may be provided in one or more layers on both surfaces of the base and at least inside of it. The viscosity of the high-molecular-weight epoxy resin is very high and the fluidity thereof is low even at a temperature at the time of lamination bonding. Even when the resin is laminated adjacently to a prepreg and subjected to pressure and heat, therefore, no mutual mixing of the resin takes place and fibers of the glass cloth are prevented from coming into contact with a copper leaf.
NAKASO AKISHI
OTSUKA KAZUHISA
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