Title:
WIRING BOARD, MANUFACTURING METHOD THEREFOR, DISPLAY DEVICE AND ELECTRONIC UNIT
Document Type and Number:
Japanese Patent JP2002164629
Kind Code:
A
Abstract:
To lighten a wiring board.
The wiring board 1 has a mounting area 14 where an integrated circuit provided with a plurality of electrodes is mounted and a plurality of base material side wirings 12 which are to be connected to the integrated circuit are formed. Conductor patterns 13 having shapes that radially extend from a prescribed point in the mounting area 14 and reach two or above grounded base material side wirings 12 are formed.
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Inventors:
KATO HIROKI
Application Number:
JP2001212083A
Publication Date:
June 07, 2002
Filing Date:
July 12, 2001
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1345; G09F9/00; H01L23/12; H05K1/02; H05K1/03; H05K1/14; H05K3/32; H05K3/34; (IPC1-7): H05K1/02; G02F1/1345; G09F9/00; H01L23/12; H05K1/03; H05K1/14; H05K3/32; H05K3/34
Attorney, Agent or Firm:
Masayanagi Ueyanagi (2 outside)