Title:
WIRING BOARD AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2017034193
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board by, by taking account of thermal expansion of an insulation material filling a first through-hole in a first insulation part and the thermal expansion of a second insulation part, reducing stress load on a third conductive part resulting mainly from the thermal expansion of the latter together with stress load on a second conductive part resulting mainly from the thermal expansion of the former, thereby preventing fracture in both as much as possible, and to provide a manufacturing method for the wiring board, and to provide an electronic apparatus.SOLUTION: A wiring board comprises: a core substrate 11 having a through-hole 11a; a conductive film 21 formed on the internal wall of the through-hole 11a; resin 22 filling the through-hole 11a via the conductive film 21; an insulation film 23 formed on the core substrate 11; a land 24 formed in the insulation film 23, electrically connected with the conductive film 21, and having a through-hole 24a on the resin 22; and a veer 26 electrically connected with the land 24 within the insulation film 23.SELECTED DRAWING: Figure 1
Inventors:
NAGAOKA HIDEAKI
AKABOSHI TOMOYUKI
MIZUTANI DAISUKE
AKABOSHI TOMOYUKI
MIZUTANI DAISUKE
Application Number:
JP2015155433A
Publication Date:
February 09, 2017
Filing Date:
August 05, 2015
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2015126053A | 2015-07-06 | |||
| JP2002280750A | 2002-09-27 |
Attorney, Agent or Firm:
Takayoshi Kokubun