Title:
WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD
Document Type and Number:
Japanese Patent JP2022115401
Kind Code:
A
Abstract:
To provide a wiring board on which a residue is inhibited from remaining.SOLUTION: A manufacturing method for a wiring board includes: forming a first conductor layer 11 on a first insulating layer 10, forming a second insulating layer 20 thereon, and forming a build-up portion 110 on the second insulating layer 20; along the periphery RCp of a region RCa, forming a groove G penetrating the build-up portion 110, and removing a portion R defined by the groove G to form a recess RC that exposes the second insulating layer 20; and, on the second insulating layer 20, forming an opening 11a that exposes the first conductor layer 11. The formation of the second insulating layer 20 includes: laminating a resin film 20f having a two-layer structure including a first layer 20 and a second layer 20b; and removing the second layer 20b's parts at positions other than a position corresponding to the region RCa. The formation of the recess RC includes removing a second layer 20br at the position corresponding to the predetermined region RCa.SELECTED DRAWING: Figure 3G
Inventors:
KIMURA RYOYA
SHIMIZU KEISUKE
SHIMIZU KEISUKE
Application Number:
JP2021011981A
Publication Date:
August 09, 2022
Filing Date:
January 28, 2021
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H05K3/00
Attorney, Agent or Firm:
Asahina Patent Office