To provide a wiring board on which micro wires are connected to each other.

The wiring board includes a substrate 5 having an adhesive surface 8, first wiring 1, and second wiring 4. The adhesive surface 8 of the substrate 5 is in contact with the first wiring 1 and the second wiring 4, and the first wiring 1 has a through hole 3, and the second wiring 4 has a first region, a second region, and a third region, which are adjacent in this order. The first region is inside the through hole 3 of the first wiring 1 and is in contact with a portion 9 being in contact with the through hole 3, of the adhesive surface 8 of the substrate 5, and the second region is in contact with the first wiring 1 and faces the first wiring 1 and the substrate 5, and the third region is in contact with a portion 10 other than a portion being in contact with the through hole 3, of the adhesive surface 8 of the substrate 5.