To provide a wiring board which is formed by laminating a plurality of ceramic layers, has a hollow portion inside, a single conductor layer formed on its bottom surface, and through-holes running through between the hollow portion and an upper surface, or the hollow portion and an external wall surface, etc., and is superior in shape and size precision, and to provide a method of manufacturing the same.
The wiring board 1a includes a board body 2 which is formed by laminating the plurality of ceramic layers s1 to s6, and has the upper surface 3 and under surface 4 which are rectangular in plane view and four external wall surfaces 5a and 5b positioned between them; the hollow portion 6 formed in the board body 2, formed inside the ceramic layers s2 to s4 being intermediate layers except the ceramic layers s1 and s6 being an uppermost layer and a lowermost layer and the ceramic layer s5 being a lower layer among the plurality of ceramic layers s1 to s6; a single conductor layer 10 formed in a plane shape on an upper surface of the ceramic layer s5 being on the lower layer side forming a floor 7 of the hollow portion 6; and the plurality of through-holes h1 running through a ceiling surface 9 of the hollow portion 6 and the upper surface 3 of the board body 2.
TOJO TAKATOSHI
DEGUCHI MASAYUKI
NAKAGAWA NAOHITO
HIRANO SATOSHI
TOYAMA YUTAKA
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