Title:
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016149517
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board which secures a strength and improves insulation reliability.SOLUTION: A wiring board includes: an insulating layer in which a second insulating film is laminated on one surface of a first insulating film and the other surface of the first insulating film is exposed to the outside; a first wiring layer having a pad and a wiring pattern that are embedded in the first insulating film and of which a predetermined surface is exposed from the other surface of the first insulating film; and a second wiring layer containing a wiring pattern formed in an opposite surface to a surface in contact with one surface of the first insulating film in the second insulating film, and a via wiring which penetrates the insulating layer and connects the wiring pattern and the first wiring layer. The first insulating film is formed of only a resin. The second insulating film has such a structure that a reinforcement member is impregnated with the resin.SELECTED DRAWING: Figure 1
Inventors:
OSHIMA KAZUHIRO
YANAGISAWA HIROHARU
KOBAYASHI KAZUHIRO
FUKASE KATSUYA
MIYAIRI TAKESHI
YANAGISAWA HIROHARU
KOBAYASHI KAZUHIRO
FUKASE KATSUYA
MIYAIRI TAKESHI
Application Number:
JP2015101245A
Publication Date:
August 18, 2016
Filing Date:
May 18, 2015
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2013021306A | 2013-01-31 | |||
| JPS61133696A | 1986-06-20 | |||
| JP2007234988A | 2007-09-13 | |||
| JP2010004028A | 2010-01-07 |
Foreign References:
| WO2011016555A1 | 2011-02-10 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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