Title:
配線基板及び配線基板の製造方法
Document Type and Number:
Japanese Patent JP7236052
Kind Code:
B2
Abstract:
To provide a wiring board capable of adjusting extensibility thereof according to the place, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 10 comprises a backing material 20 including a fixed area 30A, and a telescopic area 30B having elasticity higher than that of the fixed area 30A at least in a first direction, and wiring 52 located in the telescopic area 30B on the first surface side of the backing material 20. The fixed area 30A includes a first fixed area 31, a second fixed area 32 located around the first fixed area 31, and having dimensions smaller than those of the first fixed area 31, and a third fixed area 33 located on the side separated farther from the first fixed area 31 than the second fixed area 32. The telescopic area 30B includes a first telescopic area 34 located between the first fixed area 31 and the second fixed area 32, and a second telescopic area 35 located between the second fixed area 32 and the third fixed area 33, and having dimensions larger than those of the first telescopic area 34 in the first direction.SELECTED DRAWING: Figure 1
Inventors:
Mitsutaka Nagae
Kenichi Ogawa
Naoko Okimoto
Toru Miyoshi
Makiko Sakata
Kenichi Ogawa
Naoko Okimoto
Toru Miyoshi
Makiko Sakata
Application Number:
JP2019068200A
Publication Date:
March 09, 2023
Filing Date:
March 29, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K1/02
Domestic Patent References:
| JP201950333A | ||||
| JP2018120989A |
Foreign References:
| US20140299362 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Nakamura Yukitaka
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura
Nakamura Yukitaka
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura