Title:
WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE AND ITS MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP3842478
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To increase reliability in connection (continuity of connection terminals) between a package and a circuit board.
SOLUTION: In a package A having a mounting structure H1 for a wiring board for mounting a semiconductor device, a semiconductor device B is mounted on an insulating substrate 1, and connection electrodes 8 of the semiconductor device B and a metallized interconnection layer 2 of the insulating substrate 1 are connected by wires 9. Then, the entire body is covered with a sealing layer 10 and a plurality of stress reducing recesses 13 are formed on the surface of the sealing layer 10.
Inventors:
Kokubun Masaya
Masahiko Higashi
Masahiko Higashi
Application Number:
JP5187699A
Publication Date:
November 08, 2006
Filing Date:
February 26, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/28; H01L23/12; (IPC1-7): H01L23/28
Domestic Patent References:
| JP1126658A | ||||
| JP10340966A | ||||
| JP9312354A | ||||
| JP1145135U |