Title:
配線基板、配線装置および情報記録装置
Document Type and Number:
Japanese Patent JP7151274
Kind Code:
B2
Abstract:
To provide a wiring board, a wiring device, and an information recording device for preventing peeling of a flexible circuit connector provided on a wiring board at the time of folding.SOLUTION: A wiring board includes a paper board 30 and a wiring. The paper board 30 has at least a first board 30b1 and a second board 30b2. A flexible circuit connector 80B is provided in a bent portion 64A between the first board 30b1 and the second board 30b2. Assuming that a distance between a first fixing portion 41a and a second fixing portion 41b on the paper board 30 side is a, and the distance between a first bonding portion 42a and a second bonding portion 42b of the flexible circuit connector 80B is b, a
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Inventors:
Kentaro Abe
Hiroko Takahashi
Kayoko Nanjo
Hiroko Takahashi
Kayoko Nanjo
Application Number:
JP2018158596A
Publication Date:
October 12, 2022
Filing Date:
August 27, 2018
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K1/14; A61J7/02; H05K1/02
Domestic Patent References:
| JP2018006272A | ||||
| JP2007305897A | ||||
| JP11511056A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Nakamura Yukitaka
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Nakamura Yukitaka
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
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