To provide a wiring board which enables connection terminals to be arranged with high density and improves degree of freedom in wiring layout and improves connection reliability of connection terminals.
A wiring board 100 comprises: a laminate in which one and more insulation layers 31, 131 and one and more conductor layers 32, 132 are laminated; interconnections L2, L12 formed on the laminate; a columnar connection terminal T1 which is formed directly on the interconnection L2 and contacts at least one lateral face between both lateral faces of the interconnection L2; and a solder resist layer 4 which covers the interconnection L2 and exposes at least a part of the connection terminal T1. A width of the interconnection L2 at a position where the connection terminal T1 is formed is less than a length of the connection terminal T1 in a width direction.
ITO TATSUYA
NAGAI MAKOTO
| JP2006222257A | 2006-08-24 | |||
| JP2004119574A | 2004-04-15 | |||
| JP2010027961A | 2010-02-04 | |||
| JP2010045177A | 2010-02-25 | |||
| JP2008283140A | 2008-11-20 | |||
| JP2005243942A | 2005-09-08 | |||
| JP2009021329A | 2009-01-29 | |||
| JP2013115214A | 2013-06-10 |
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