Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP3825326
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress fluctuation of resistance value due to variance of resistor shape or of resistor element when integrally sintering an insulation substrate composed of glass ceramic. and a resistor.
SOLUTION: A wiring board is provided with an insulation substrate 3 comprising a glass ceramic sintered body, a resistor 1 integrally sintered with the insulation substrate 3 inside of and/or on a surface of the substrate 3, and a wiring conductor 2 whose ends are connected overlapping with the upper portions of both ends of the resistor 1. The resistor 1 in the wiring board contains 40-70 mass% tin oxide and 30-60 mass% platinum. Resistance value of the resistor 1 is stabilized by controlling reaction/diffusion phenomenon with glass ceramics with a resistor composition material, and by stabilizing the resistor shape.
Inventors:
Shunichi Fujii
Application Number:
JP2002011153A
Publication Date:
September 27, 2006
Filing Date:
January 21, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/16; C03C17/36; F24J3/08; G01K17/06; H01L23/14; (IPC1-7): H05K1/16; C03C17/36; H01L23/14
Domestic Patent References:
| JP9139563A | ||||
| JP7283543A | ||||
| JP53016153U |
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