Title:
配線基板
Document Type and Number:
Japanese Patent JP4705377
Kind Code:
B2
Abstract:
A PCB that can transmit a high frequency signal of a GHz band with a low loss includes an insulator and magnetic nanoparticles dispersed in the insulator.
Inventors:
Mikihisa Mizuno
Yuichi Sasaki
Makoto Inoue
Kenji Yazawa
Yasuo Tateno
Miyauchi Teiichi
Ken Takahashi
Yuichi Sasaki
Makoto Inoue
Kenji Yazawa
Yasuo Tateno
Miyauchi Teiichi
Ken Takahashi
Application Number:
JP2005007887A
Publication Date:
June 22, 2011
Filing Date:
January 14, 2005
Export Citation:
Assignee:
ソニー株式会社
高橋 研
高橋 研
International Classes:
H05K1/03; B32B5/16; H01P3/08; H01P5/18; H05K1/02
Domestic Patent References:
| JP2004048736A | ||||
| JP2002517085A | ||||
| JP2003055703A | ||||
| JP2003263724A | ||||
| JP2003263729A | ||||
| JP2001335689A | ||||
| JP2004055363A | ||||
| JP2004262956A | ||||
| JP2007519219A | ||||
| JP2004269555A |
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara
Tetsuo Kanamoto
Koji Hagiwara