Title:
Wiring board
Document Type and Number:
Japanese Patent JP5981265
Kind Code:
B2
Inventors:
Hisayoshi Wada
Application Number:
JP2012181253A
Publication Date:
August 31, 2016
Filing Date:
August 18, 2012
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2012033529A | ||||
| JP2002353588A | ||||
| JP2006211070A |