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Title:
WIRING CIRCUIT BOARD ARRANGEMENT SHEET CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2008034461
Kind Code:
A
Abstract:

To provide a wiring circuit board arrangement sheet cutting device for cutting the wiring circuit board arrangement sheet for each line to improve safety of the cutting operation and replacing operation, even if a clearance between the wiring circuit boards is narrow, ensuring easier maintenance in view of suppressing maintenance cost, and moreover providing less possibility for reduction of quality of the wiring circuit board.

A sheet 3 on which a plurality of wiring circuit boards 2 are regularly arranged is placed on a sheet placing plate 31 (receiving plate 32) of a movable part 5, and the movable part 5 is then moved in the longitudinal direction sliding along a fixing part 4. Consequently, the sheet 3 can be cut for each line with a wire 20 of the fixing part 4. In this case, the sheet 3 can be cut for each line by reducing a diameter of the wire 20 even when a clearance is small between the wiring circuit boards 2. Moreover, the wire 20 is safer than a sharp rotating blade, and therefore safety of the cutting operation and replacing operation can be improved.


Inventors:
IWASAKI YUICHI
KATAOKA KOJI
MIZUSHIMA AYA
Application Number:
JP2006203393A
Publication Date:
February 14, 2008
Filing Date:
July 26, 2006
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H05K3/00; B26D1/547
Attorney, Agent or Firm:
Hiroyuki Okamoto



 
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