To provide a wiring circuit board with bumps with which stable bump connection can be achieved and complicated operations such as pretreatment of plating is unnecessary.

An etching mask 7 for forming bumps is formed on a bump forming surface of a metal foil 3, having a thickness (t1+t2) obtained by adding the thickness t1 of a wiring circuit 1 can the height t2 of a bump 2 to be formed on the wiring circuit 1 and surface roughness of 0.2-20 μm. The bump 2 having an end surface with surface roughness of 0.2-20 μm is formed by half-etching the metal foil 3 from the side of the etching mask 7 for forming bumps to the depth corresponding to an expected bump height t2.