Title:
配線回路基板
Document Type and Number:
Japanese Patent JP4133786
Kind Code:
B2
Abstract:
The width of a particular part (A) of a strip conductor 2 of a wiring circuit board for mounting is reduced, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component. The particular part (A) is one section in the longitudinal direction of a strip conductor having a long end, which part includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. Due to this constitution, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.
Inventors:
Yasuto Ishimaru
Kensuke Nishi
Hiroshi Yamazaki
Kensuke Nishi
Hiroshi Yamazaki
Application Number:
JP2003418161A
Publication Date:
August 13, 2008
Filing Date:
December 16, 2003
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L23/12; H01L21/60; H01L23/498; H05K1/02; H05K1/11; H05K3/32
Domestic Patent References:
| JP10199930A | ||||
| JP63034997A | ||||
| JP2002151806A |
Attorney, Agent or Firm:
Takashima Ichi