Title:
WIRING FORMING DEVICE AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002343797
Kind Code:
A
Abstract:
To provide a device and a method for forming wiring by which a series of copper wiring forming process steps for forming copper wiring by embedding copper can be consecutively performed while omitting the CMP treatment itself or reducing the load of CMP treatment as much as possible.
The wiring forming device forms copper wiring by forming a copper film on the surface of a substrate and embedding the copper in fine depressions. A transfer pathway 25 for transferring substrates is provided in a housing 10, and a copper plating part 12, electrolytic or chemical polishing parts 18 and 20 and an annealing part 16 are placed along the transfer pathway 25.
Inventors:
MATSUDA NAOKI
Application Number:
JP2001197328A
Publication Date:
November 29, 2002
Filing Date:
June 28, 2001
Export Citation:
Assignee:
EBARA CORP
International Classes:
C25D5/48; C23F1/00; C23F3/06; C25D7/12; C25F3/22; C25F3/30; C25F7/00; H01L21/288; H01L21/304; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; C23F1/00; C23F3/06; C25D5/48; C25D7/12; C25F3/22; C25F3/30; C25F7/00; H01L21/288; H01L21/304
Attorney, Agent or Firm:
Isamu Watanabe (3 outside)