Title:
WIRING LEAD-IN STRUCTURE
Document Type and Number:
Japanese Patent JP2014220870
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring lead-in structure capable of preventing water from leaking into an inside of a building for a long period with a simple structure.SOLUTION: A wiring lead-in structure provided on roof members (21, 22) of a building (1) comprises: a roof hole part (20) into which a connection wire (10) arranged on the roof members (21, 22) is inserted; and a wiring housing member (3) arranged in a lower position of the roof hole part (20). The wiring housing member (3) includes a draining guide face (32) and a wiring lead-in opening (36). The draining guide face (32) receives water from the roof hole part (20) in a lower position and guides the drained water to outside the building (1). The wiring lead-in opening (36) is positioned in an upper stream side than a position of the roof hole part (20), and leads the connection wire(10) introduced from the roof hole part (20) inside the building (1) along the draining guide face (32).
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Inventors:
YASUE TOSHIHIKO
Application Number:
JP2013096543A
Publication Date:
November 20, 2014
Filing Date:
May 01, 2013
Export Citation:
Assignee:
DAIWA HOUSE IND
International Classes:
H02G3/22; E04D13/18; H02G3/38
Domestic Patent References:
| JPH11159090A | 1999-06-15 | |||
| JP2001311279A | 2001-11-09 | |||
| JP2010229771A | 2010-10-14 | |||
| JPS1144035B1 |
Foreign References:
| US8291658B1 | 2012-10-23 |
Attorney, Agent or Firm:
Patent business corporation eye I international patent firm
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