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Title:
WIRING LEAD-IN STRUCTURE
Document Type and Number:
Japanese Patent JP2016089330
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring lead-in structure with a simple configuration capable of preventing water leakage from immersing into a building for a long period.SOLUTION: A wiring lead-in structure comprises: a roof hole part (20) into which a connection line (10) wired on a roof part (2) of a building (1) is inserted; and a wiring storage member (3) disposed on a rear surface side of the roof part (2). The wiring storage member (3) includes a drain guide surface (32) and a wire lead-in opening (36). The drain guide surface (32) continues to the roof hole part (20), extends from the roof hole part (20) toward an upstream side of the roof part (2), receives the water immersed from the roof hole part (20), and drains the immersed water outside from the roof hole part (20) by gravity. The wire lead-in opening (36) is disposed at a position on an upstream end side of the drain guide surface (32) in oder to lead in the connection line (10) inserted into the roof hole part (20) to the inside of the building (1) along the drain guide surface (32).SELECTED DRAWING: Figure 1

Inventors:
YASUE TOSHIHIKO
Application Number:
JP2014220450A
Publication Date:
May 23, 2016
Filing Date:
October 29, 2014
Export Citation:
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Assignee:
DAIWA HOUSE IND
International Classes:
E04D13/00; E04D3/40; E04D13/18; H02G3/04
Domestic Patent References:
JPH11159090A1999-06-15
JP2001311279A2001-11-09
JP2010229771A2010-10-14
JPH1144035A1999-02-16
JP2014220870A2014-11-20
Attorney, Agent or Firm:
Patent Business Corporation Imy International Patent Office