To enhance an adhesion of a ruthenium metallic film and to lower its resistance value, by adding a specific atomic % of oxygen, to ruthenium metal or an alloy composed mainly of ruthenium metal.
A MOSFET 10 is provided with a silicon substrate 11, and on it a field oxide film 12 and a gate oxide film 13 are formed. On this gate oxide film 13 a gate electrode 17 is formed with a drain 14, a source 15 and a ruthenium film 16 in a vacuum tank by a sputtering apparatus. If 0.01-0.1 atomic % of oxygen is added to a gas such as a neon gas, etc., in this sputtering, its resistance value decreases sharply compared to a case of no oxygen, and it becomes possible to reduce noise as well as to solve gain shortage, when the MOSFET 10 is used in a high frequency region. Besides, it becomes possible to increase the degree of bonding, and to enhance adhesion by adding oxygen.
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