Title:
WIRING MEMBER AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3887337
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring member that hardly causes the sinking, deviation, etc., of wiring at laminating time and has a continuity pattern having a sufficient film thickness.
SOLUTION: This wiring member is provided with a sheet-like porous substrate (11) containing many three-dimensionally branched continuous pores having openings in the first and second main surfaces (11a and 11b) of the substrate (11), and a conductive section (12) which is formed on the first main surface (11a) of the porous substrate (11) and at least partially forms a mutually intruding structure (13) with the porous substrate (11) at the interface with the substrate (11). At least, either one of the mean diameter or mean opening ratio of the openings formed in the first main surface (11a) of the substrate (11) is smaller than that of the openings formed in the second main surface (11b) of the substrate (11).
Inventors:
Toshiro Hiraoka
Yasuyuki Hotta
Shigeru Matake
Misa Sawato
Hiroshi Yamada
Yasuyuki Hotta
Shigeru Matake
Misa Sawato
Hiroshi Yamada
Application Number:
JP2003083130A
Publication Date:
February 28, 2007
Filing Date:
March 25, 2003
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01B5/14; H05K1/02; H01B13/00; H01L23/14; H01L23/15; H01L23/498; H05K3/10; H05K3/12; H05K3/38; H05K1/03; (IPC1-7): H05K1/02; H01B5/14; H01B13/00; H01L23/14; H01L23/15; H05K3/12
Domestic Patent References:
| JP2002111227A | ||||
| JP2002261437A | ||||
| JP2001127389A |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto