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Patent Searching and Data


Title:
WIRING STRUCTURE, AND DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2008064961
Kind Code:
A
Abstract:

To provide a wiring structure with which resistance difference between laying wires is reduced, and a display device using the same.

The wiring structure includes a first conductive layer formed on a substrate, a second conductive layer, and an insulating film arranged between the first conductive layer and the second conductive layer, and includes: a plurality of scanning wires 3 (or signal wires 4) formed of the first conductive layer; a first routing wire 61 formed of the first conductive layer and separated from the wires; a first connecting portion 91 to electrically connect the first routing wire 61 to the wires; a second routing wire 62 formed of the second conductive layer and prepared for wires, out of the plurality of wires, which are not connected to the first rounting wire 61; and a second connecting portion 92 to connect the second routing wire 62 to the wires.


Inventors:
NAKAMURA TOMOKI
Application Number:
JP2006241524A
Publication Date:
March 21, 2008
Filing Date:
September 06, 2006
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G09F9/30; G02F1/1345; G02F1/1368
Attorney, Agent or Firm:
Ken Ieiri