To provide a wiring structure enabling a wiring size to be small and elements to be highly integrated in the wiring structure having pads, integrated circuitry having the wiring structure, and also to provide a solid-state image pickup device having the wiring structure, and an imaging device having the solid-state image pickup device.

The wiring structure is such that two or more wiring are put side by side on a plane surface, wherein the interconnects consist of two or more pads arranged at constant intervals in right and left directions and conductive wires connecting the adjacent pads, which has a width narrower than that of the pads, two conductive wires extend from one pad so as to be in mutually opposite directions and parallel, and in the two conductive wires, the upper side of one conductive wire is on the same straight line as the one pad's uppermost edge while the lower side of the other conductive wire is on the same straight line as the one pad's lowest edge, a line linking the gravity centers of all the pads in the one interconnect makes a straight line that is non-parallel with the extending direction of the conductive wire, the lines linking the gravity centers are parallel with each other, and mutually adjacent wiring make the minimum wiring interval or an interval wider than that.