Title:
配線構造
Document Type and Number:
Japanese Patent JP7424492
Kind Code:
B2
Abstract:
A trace structure includes a first signal line in which a first outer layer conductor on a top surface of a dielectric substrate, a first via, a first inner layer conductor, a second via, and a second outer layer conductor on a bottom surface of the substrate are electrically connected, and a second signal line in which a third outer layer conductor on the top surface, a third via, a second inner layer conductor, a fourth via, and a fourth outer layer conductor on the bottom surface are electrically connected, and in which the first and second inner layer conductors have substantially equivalent lengths and are arranged on different planes each parallel to the bottom surface to overlap each other in a vertical direction, and a sum of lengths of the first and second vias is substantially equivalent to a sum of lengths of the third and fourth vias.
Inventors:
Hitoshi Wakita
Nobuo Sato
Nobuo Sato
Application Number:
JP2022532954A
Publication Date:
January 30, 2024
Filing Date:
July 02, 2020
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H05K3/46; H01P5/18
Domestic Patent References:
| JP2008244703A | ||||
| JP2015216362A |
Foreign References:
| WO2008105478A1 |
Attorney, Agent or Firm:
Shigeki Yamakawa
Yuzo Koike
Masaki Yamakawa
Yasushi Motoyama
Yuzo Koike
Masaki Yamakawa
Yasushi Motoyama
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