Title:
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, PANEL FOR IMAGE DISPLAY DEVICE USING THE SAME, AND IMAGE DISPLAY DEVICE ON WHICH PANEL IS MOUNTED
Document Type and Number:
Japanese Patent JP2009206432
Kind Code:
A
Abstract:
To solve a problem that a sufficient adhesion strength cannot be obtained between wiring and a base in the case of a groove wiring structure in which TaN (hexagonal crystal), Ta, and copper are formed in this order on a base using glass as a material.
A wiring substrate has a glass base on which copper wiring is formed. The wiring substrate has a laminated structure in which Ta2N film, Ta film, and a film made of copper or an alloy mainly composed of copper are formed in order.
Inventors:
Aoyama, Nobuyuki
Sawada, Masayoshi
Enomoto, Takashi
Eto, Hideo
Sawada, Masayoshi
Enomoto, Takashi
Eto, Hideo
Application Number:
JP2008000049864
Publication Date:
September 10, 2009
Filing Date:
February 29, 2008
Export Citation:
Assignee:
CANON INC
International Classes:
H01L21/3205; G09F9/30; H01J1/316; H01J9/02; H01J31/12; H01L23/52; H05K3/24; H01L21/02; G09F9/30; H01J1/30; H01J9/02; H01J31/12; H01L23/52; H05K3/24
Previous Patent: STORAGE
Next Patent: MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Next Patent: MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF