Title:
WIRING SUBSTRATE AND PRINTED CIRCUIT SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2001111185
Kind Code:
A
Abstract:
To provide a wiring substrate which has high dimensional precision, excellent heat-resistant properties in a thermal treatment process and excellent durability and reliability under high temperature and high humidity conditions and can prevent the delamination of a photoprocess layer from the substrate.
A wiring substrate is composed of an insulator mainly made of epoxy resin and ceramics with a thermal expansion coefficient of not larger than 2 ppm/°C and has an isotropic thermal expansion coefficient.
Inventors:
ODAGIRI TADASHI
NONAKA HISAYOSHI
TABUCHI YOSHITAKA
SUZUKI TOMIO
NONAKA HISAYOSHI
TABUCHI YOSHITAKA
SUZUKI TOMIO
Application Number:
JP2000193497A
Publication Date:
April 20, 2001
Filing Date:
June 27, 2000
Export Citation:
Assignee:
NGK INSULATORS LTD
International Classes:
C08K3/00; C08G59/42; C08K3/36; C08K7/18; C08L63/00; C08L63/02; C08L63/04; H05K1/03; H05K1/11; H05K3/00; H05K3/40; (IPC1-7): H05K1/03; C08G59/42; C08K3/00; C08K7/18; C08L63/00; H05K1/11; H05K3/00
Attorney, Agent or Firm:
Ippei Watanabe