Title:
配線基板、電子装置及び電子モジュール
Document Type and Number:
Japanese Patent JP7237687
Kind Code:
B2
Abstract:
To provide a wiring board that has an improved resistance against fracture of the boundary between a SiC substrate and a conductor layer that is ohmically joined thereto; and to provide an electronic apparatus and an electronic module having improved reliability.SOLUTION: A wiring board comprises: a SiC substrate; and a NiSi layer that is ohmically joined to the SiC substrate and has a porous structure. The electronic apparatus is formed by mounting an electronic component on such a wiring board. An electronic module is formed by mounting such an electronic apparatus on a substrate for a module.SELECTED DRAWING: Figure 2
Inventors:
Seiichiro Ito
Application Number:
JP2019062270A
Publication Date:
March 13, 2023
Filing Date:
March 28, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/13
Domestic Patent References:
| JP10284436A | ||||
| JP2018182323A | ||||
| JP2018098227A | ||||
| JP2002094168A | ||||
| JP2007149983A |
Foreign References:
| WO2011115294A1 | ||||
| CN101916746A |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune