Title:
配線基板、電子装置及び電子モジュール
Document Type and Number:
Japanese Patent JP7292977
Kind Code:
B2
Abstract:
To provide a wiring board having a SiC substrate, a NiSi layer ohmically joined to the SiC substrate, and a conductor film on the NiSi layer, and prevent interlayer separation of the films; and to provide an electronic apparatus and an electronic module having high reliability.SOLUTION: The wiring board (1) comprises: a SiC substrate (10) that has a principal surface (S1); a NiSi layer (11A) that is ohmically joined to a partial range of the principal surface; and a conduction film (20A) that is located on the NiSi layer and the principal surface. An electronic apparatus comprises: the wiring board (1); and an electronic component mounted on the wiring board. The electronic module comprises: the electronic apparatus; and a substrate for a module that has the electronic apparatus mounted thereon.SELECTED DRAWING: Figure 1
Inventors:
Seiichiro Ito
Application Number:
JP2019099255A
Publication Date:
June 19, 2023
Filing Date:
May 28, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/38
Domestic Patent References:
| JP2020161754A | ||||
| JP2018182323A | ||||
| JP2017063145A | ||||
| JP2011054698A |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune