Title:
木質材料複合板及びその製造方法
Document Type and Number:
Japanese Patent JP7015857
Kind Code:
B2
Abstract:
The invention disclosures a wood composite board and a preparation method thereof, comprising: mixing wood materials with the adhesive evenly, paving the mixed wood materials on the boards, and then forming through high-temperature and hot-pressing, the wood composite board of the invention has good evenness, high surface bonding strength, low moisture content, good dimensional stability, anti-cracking and anti-thermocycling performance, can use compound adhesives such as polyurethane adhesive, formaldehyde-free biomass adhesive or formaldehyde-type adhesives, waterproofing agent, mildew preventive, etc., and by the invention, fiber finish coat with different environmental protection standards can be produced according to market requirements, and the fiber finish coat has a low thickness swelling rate of water absorption and a thickness of 0.5-3mm.
Inventors:
Dai family soldier
Application Number:
JP2020041436A
Publication Date:
February 03, 2022
Filing Date:
March 11, 2020
Export Citation:
Assignee:
南▲寧▼科天水性科技有限▲責▼任公司
International Classes:
B27N1/02; B27D1/04; B27N3/04; B27N3/12
Domestic Patent References:
| JP6220979A | ||||
| JP10235606A | ||||
| JP2620164B2 | ||||
| JP6293769B2 | ||||
| JP4791437B2 | ||||
| JP8332610A |
Foreign References:
| WO2019075765A1 |
Attorney, Agent or Firm:
Hiroki Ohara
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