Title:
木質ボード及びその製造方法
Document Type and Number:
Japanese Patent JP7042560
Kind Code:
B2
Abstract:
To provide a woody board advantageous as a building material having a heat storage property capable of providing a comfortable dwelling space with energy conservation.SOLUTION: A woody board is provided that a front layer, a core layer, and a front layer are laminated in this order and the front layer consists of a woody material and a thermoset resin and the core layer consists of a woody material, a thermoset resin, a latent heat storage material, and a thermoplastic resin and it is characterized in that in the core layer the latent heat storage material is carried by the thermoplastic resin and present in a granular shape.SELECTED DRAWING: Figure 1
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Inventors:
Masashi Fukuya
Tomoyoshi Murakami
Hiroshi Taniwaki
Eiji Kasaoka
Tomoyoshi Murakami
Hiroshi Taniwaki
Eiji Kasaoka
Application Number:
JP2017109657A
Publication Date:
March 28, 2022
Filing Date:
June 02, 2017
Export Citation:
Assignee:
Okura Industry Co., Ltd.
International Classes:
B27K3/34; B27N3/02; B27K3/36; B27K3/38; E04B1/76; E04B1/80
Domestic Patent References:
| JP2012518563A | ||||
| JP2014069368A | ||||
| JP2003260705A |
Foreign References:
| US20030113530 |
Other References:
近藤武士ほか,潜熱蓄熱壁体による躯体蓄熱システムに関する研究,日本建築学会計画系論文集,2001年02月,第540号,23-29頁
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