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Title:
WOOD FINISH BOARD
Document Type and Number:
Japanese Patent JP2000025017
Kind Code:
A
Abstract:

To prevent warpage from occurring by minimizing the dimensional variations of a decorative material, a surface layer consisting of a sheet and a bed plate with each other, before and after pressing and reduce the rate of rejects due to imperfect processing at the time of production with the achieving of enhancing application properties and further increase the flaw resistance by the impregnation of a decorative material with the resin of a sheet.

A prepreg-state sheet 2 containing a heat-setting resin is superposed on a bed plate 1 which can be impregnated with a resin and is laminated with a decorative material 3 which can is impregnated with the resin and further these three materials are thermally pressed to obtain the wood finish board of the mutually bonded materials. In addition, the bed plate 1, the moisture content of which is adjusted to be above 10 wt.% by curing the bed plate 1 under high humidity conditions prior to thermal pressing or curing after water spray, is used.


Inventors:
EGUCHI SHINICHI
UENISHI NOBUAKI
YANAGI HIDESHI
ABE MASANORI
FUNASE TADAAKI
Application Number:
JP19340398A
Publication Date:
January 25, 2000
Filing Date:
July 08, 1998
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
B27M3/00; B32B21/08; E04C2/24; E04F13/08; (IPC1-7): B27M3/00; B32B21/08; E04C2/24; E04F13/08
Domestic Patent References:
JPH09117903A1997-05-06
JPH0825568A1996-01-30
JPH09187802A1997-07-22
JPH09141609A1997-06-03
Attorney, Agent or Firm:
Takeo Masuda