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Title:
WOOD FLOUR RESIN COMPOSITION, FLOORING, AND DECORATIVE FLOORING
Document Type and Number:
Japanese Patent JP3960143
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a wood flour-filled wood flour resin composition, to provide a flooring obtained by molding the resin composition, to provide a decorative flooring made from the flooring, and to provide a wood flour resin composition with high dimentional precision and causing small expansion and shrinkage.
SOLUTION: The wood flour resin composition comprises a thermoplastic resin, wood flour, and a scaly inorganic filler having an aspect ratio of 10 or larger. The scaly inorganic filler having an aspect ratio of 10 or larger enables a molding obtained by molding the resin composition to have performances such a high dimensional accuracy, a low expansion, and a low shrinkage.


Inventors:
Satoru Konishi
Hiroaki Usui
Noh Nohma
Riki Watanabe
Tsukamoto Masasuke
Application Number:
JP2002184900A
Publication Date:
August 15, 2007
Filing Date:
June 25, 2002
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B32B27/04; D06N1/00; B44C3/02; C08J5/18; C08K3/00; C08K3/22; C08K3/34; C08L23/06; C08L23/12; C08L97/02; C08L101/00; (IPC1-7): C08L101/00; C08J5/18; C08K3/00; C08K3/22; C08K3/34; C08L23/06; C08L23/12; C08L97/02; D06N1/00; //(C08L101/00; C08L23:26)
Domestic Patent References:
JP11172121A
JP59217744A
JP2000044809A
JP2001064451A
JP61016965A
JP56161445A
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori