Title:
WOODY BOARD LAMINATE
Document Type and Number:
Japanese Patent JP2006043885
Kind Code:
A
Abstract:
To provide a woody board laminate excellent in safety, having biodegradability and low in production cost.
The woody board laminate is composed of at least two woody boards and the cured resin composition layer interposed between two adjacent woody boards. A cured resin composition comprises a cured reaction product of a mixture containing a polyol (i), a polyisocyanate (ii) and a soluble biodegradable substance (iii) dissolvable in the polyol and the ratio of the soluble biodegradable substance is 10-50 wt.% of the cured resin composition.
Inventors:
Hatakeyama, Hyoe
Fujii, Hirotomo
Hirose, Shigeo
Fujii, Hirotomo
Hirose, Shigeo
Application Number:
JP2003000068761
Publication Date:
February 16, 2006
Filing Date:
March 13, 2003
Export Citation:
Assignee:
KANAI EDUCATIONAL INSTITUTION
International Classes:
B27D1/04; B32B7/12; B32B21/04; B32B21/08; B32B21/13; C08G18/64; C08G18/76; C09J175/04; C09J197/00; C09J199/00
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