Title:
WOODY FIBER BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2001334510
Kind Code:
A
Abstract:
To provide a woody fiber board having an excellent heat insulating property.
A thermosetting resin is uniformely fused to a core part by hot air heating a mat M of a raw material mixture R containing a woody fiber and a thermoplastic resin, and the woody fiber is joined together to manufacture the woody fiber board of 0.03-0.08 g/cm2 in density.
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Inventors:
Kimuro, Makoto
Mabuchi, Ryuhei
Mabuchi, Ryuhei
Application Number:
JP2000000159979
Publication Date:
December 04, 2001
Filing Date:
May 30, 2000
Export Citation:
Assignee:
NICHIHA CORP
International Classes:
B27N3/04; B27N3/12; B32B21/02; E04B1/80; B27N3/04; B27N3/08; B32B21/00; E04B1/80; (IPC1-7): B27N3/04; B27N3/12; B32B21/02; E04B1/80
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