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Patent Searching and Data


Title:
WOODY LAMINATE
Document Type and Number:
Japanese Patent JP11019909
Kind Code:
A
Abstract:

To obtain a woody laminate layer which is light weighted and low costed in a good yield of a wood thin piece by making interface separation difficult to be generated by a method wherein a horizontal orientation degree of the wood thin piece in a section vertical to a press surface is made a specific value or under.

A wood laminate is obtained by a method wherein a suitable amount of an adhesive is mixed in a wood thin piece and oriented, and thereafter it is hardened by compression by forming in a plate shape or in a columnar shape. A horizontal orientation degree of the wood thin piece on a section vertical to a press surface is 0.5 or under, and especially preferably 0.16-0.5. Then, it is made 0 to ±30 or 150 to 180 to the press surface being the horizontal surface of the wood laminate 10. Thereby, the adhesive surface is scarcely arranged horizontally, fracture due to interface separation becomes hard to be generated, and the wood laminate having excellent strength is obtained. Further, swelling in a thickness direction of the wood thin piece owing to absorption of water can be dispersed.


Inventors:
Morishita, Shigeru
Imai, Kanji
Nanba, Kazushi
Miyato, Hisashi
Application Number:
JP1997000181026
Publication Date:
January 26, 1999
Filing Date:
July 07, 1997
Export Citation:
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Assignee:
DAIKEN TRADE & IND CO LTD
International Classes:
B27N3/04; B27N3/08; B27N3/14; B27N3/04; B27N3/08; (IPC1-7): B27N3/04; B27N3/08; B27N3/14