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Title:
ワークの研削方法及び研削盤
Document Type and Number:
Japanese Patent JP5440159
Kind Code:
B2
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JP5437680Double-sided grinding device and double-sided grinding method for semiconductor wafers
Inventors:
Okuri
Application Number:
JP2009294682A
Publication Date:
March 12, 2014
Filing Date:
December 25, 2009
Export Citation:
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Assignee:
JTEKT Corporation
International Classes:
B24B49/04; B24B5/04; B24B5/06; B24B49/10; B24B49/12
Domestic Patent References:
JP2009214217A
JP5245743A
JP2005262425A
JP60249573A
JP3032561A
Attorney, Agent or Firm:
Okada International Patent Office



 
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