Title:
被加工物の処理方法
Document Type and Number:
Japanese Patent JP7077108
Kind Code:
B2
Abstract:
A method of processing a workpiece includes: forming a ruthenium film on the workpiece and disposing a mask on the ruthenium film; etching the ruthenium film through a plasma processing; forming a protective film on the workpiece through an atomic layer deposition method, the protective film including a first region extending along a side wall surface of the mask and a second region extending over the ruthenium film; and etching the protective film so as to remove the second region while leaving the first region. The etching the ruthenium film includes a first step of etching the ruthenium film through a plasma processing using an oxygen-containing gas, and a second step of etching the ruthenium film through a plasma processing using a chlorine-containing gas. The first step and the second step are alternately performed.
Inventors:
Yuto Nagatomo
Takahiko Kato
Takahiko Kato
Application Number:
JP2018073189A
Publication Date:
May 30, 2022
Filing Date:
April 05, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; C23F1/00; C23F4/00; H01L21/28
Domestic Patent References:
| JP2016131238A | ||||
| JP2007305892A | ||||
| JP2012019242A | ||||
| JP2017076784A | ||||
| JP2017212331A | ||||
| JP11111683A | ||||
| JP5275402A | ||||
| JP2003027240A | ||||
| JP2001284317A | ||||
| JP2008532324A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Teppei Omori
Yoshiki Kuroki
Junji Kashiwaoka
Teppei Omori
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