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Title:
WORK POLISHING METHOD AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JP2004363181
Kind Code:
A
Abstract:

To accurately detect a current change indicating a polishing end point at the time when the change of a motor drive current that occurs when an upper platen comes into contact with a carrier is detected so as to stop a polishing device.

A control device 11 controlling motors M1 to M4 is equipped with a current detecting device 23 which detects the drive current of the motor M1 for driving the upper platen, and an inflection point detecting device 24 that detects an inflection point at which a current value varies and stops a polishing operation. Further, the polishing device is equipped with a timing setting device 25 which measures the thickness of a polished work W and turns on the inflection point detecting device 24 just before the thickness of the work W gets equal to a target thickness.


Inventors:
SHIMIZU TOSHIKUNI
Application Number:
JP2003156881A
Publication Date:
December 24, 2004
Filing Date:
June 02, 2003
Export Citation:
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Assignee:
SPEEDFAM CO LTD
International Classes:
B24B49/02; B24B37/013; B24B37/07; B24B49/16; H01L21/304; (IPC1-7): H01L21/304; B24B37/04; B24B49/02; B24B49/16
Domestic Patent References:
JP2004165356A2004-06-10
JPH1044035A1998-02-17
JPH06252112A1994-09-09
JP2004165356A2004-06-10
JPH1044035A1998-02-17
JPH06252112A1994-09-09
Attorney, Agent or Firm:
Hiroshi Hayashi
Masahiko Goto
Hayashi Naoki



 
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