To provide a work polishing method and a polishing system satisfactorily peeling a work form an upper surface plate without sticking the work to the upper surface plate and without generating a scar or a defect on the work in a polishing process.

Double-sided polishing is applied to the work by pinching the work held by a carrier between upper and lower surface plates and rotating the upper and lower surface plates in the axis perpendicular to the machined face of the work respectively in this work polishing method. The upper surface plate is lifted by the prescribed quantity in a range smaller than the thickness of the work before the rotation of the upper and lower surface plates is stopped after the work polishing is finished.