Title:
被加工物の加工方法および加工装置
Document Type and Number:
Japanese Patent JP7115850
Kind Code:
B2
Abstract:
A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.
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Inventors:
Shinya Watanabe
Ichiro Yamabata
Katsuhiko Suzuki
Ichiro Yamabata
Katsuhiko Suzuki
Application Number:
JP2017253566A
Publication Date:
August 09, 2022
Filing Date:
December 28, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B7/04; B24B41/06; B24B49/02; B24B49/12; B24B53/007
Domestic Patent References:
| JP2005303214A | ||||
| JP2013118324A | ||||
| JP2012161848A | ||||
| JP2011003611A | ||||
| JP2007136636A | ||||
| JP2013103283A | ||||
| JP7045569A | ||||
| JP2014103215A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office