Title:
WORKPIECE SPLITTING METHOD AND OBJECT PRODUCING METHOD
Document Type and Number:
Japanese Patent JP2010110818
Kind Code:
A
Abstract:
To suppress pressing force acting on a workpiece when forming a splitting starting point on the workpiece.
A first laser beam is transmitted through a TFT (thin film transition)-side polarization plate 7 and is applied to a TFT substrate 2 so as to form modified regions U1a to U3a in the TFT substrate 2. Thus, for example, differently from a method where a scribe groove is physically formed on the TFT substrate 2, the pressing of force acting on the TFT substrate 2 can be suppressed when forming a splitting starting point on the TFT substrate 2.
Inventors:
Umetsu, Kazunari
Yamazaki, Yutaka
Yamazaki, Yutaka
Application Number:
JP2009000191297
Publication Date:
May 20, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B23K26/38; B23K26/00; B23K26/40; B28D5/00; C03B33/09
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