To uniformize the silicon wafer thickness in a plane grinding process, and to improve a product yield by providing a worktable inclination adjusting device for reducing influence of a backlash with high accuracy, strong against bending force with high rigidity, causing little a secular change, easy in an adjustment, and easily installable in a plurality.
An adjusting part 2 is equally arranged for tensioning and fixing a base 24 and an outer peripheral collar part 23 of a holding part 22 for rotatably holding a worktable 21 by an elastic member 6 via pedestals 3, 4 and 5. The pedestals are divided into two parts of the moving pedestal 3 and the lower pedestal 4 in the tensile direction by inclined faces 3a and 3b, and can vary the tensile directional length by longitudinally dislocating the moving pedestal in parallel to the base by a feed screw 9 arranged in the lower pedestal. One of the adjusting part is formed as a fixing part 35 for tensioning and fixing the collar part and the base via the fixed pedestal 5. The collar part and the base are fixed in the tensile direction by bolts 7 and 8 by penetrating through holes 3b, 4b and 5b of the pedestals.
TAKEHARA AKIHIDE
MORITA KAZUHITO
SAKAE YOSHIHITO
| JPH0890376A | 1996-04-09 | |||
| JP2000343355A | 2000-12-12 | |||
| JPS48100290U | 1973-11-26 | |||
| JPS62238490A | 1987-10-19 | |||
| JPH0679751A | 1994-03-22 | |||
| JPH0469166A | 1992-03-04 | |||
| JPS62107935A | 1987-05-19 |
Next Patent: SKATE BLADE POLISHING DEVICE